Become a partner
Fortify is continually expanding our network of CM, Material and Technology partners. If you’re interested in becoming a partner click the button below, complete the form, and we will be in touch very soon!
Material: Radix Printable Dielectric
Key Material Properties: Dielectric Constant: 2.8, Dissipation Factor (@ 24 GHz): 0.0046
Applications: Printing components and devices used in wide bandwidth, high frequency communication and sensing systems. Tailored for microwave and mmWave applications.
Material: Digital Tooling
Key Material Properties: Heat Deflection Temperature (@ 0.455 MPa):>300℃, Tensile Strength: 90 MPa
Applications: Tooling for injection molding or thermoforming
Material: Thermally Conductive Dielectric Resin
Key Material Properties: Thermal Conductivity: 2 W/mK, Electrical Resistivity: 1016 Ω·cm
Applications: Thermal management applications requiring electrical insulation
Material: ESD High Temperature Resin
Key Material Properties: Surface Resistivity: 106 Ω·cm, Heat Deflection Temperature (@ 0.455 MPa): 284℃
Applications: Preventing static charge build-up on parts in operating conditions up to 284℃
Material: High Purity Alumina (99.8%)
Key Material Properties: Chemical Purity: 99.8%, Operating Temperature: 1750℃
Applications: Aerospace and Aviation – Bearings, seals, and thermal shields, Medical – Surgical implants, tools and guides, Chemical production: Components that will survive rapid temperature changes, pressure, and corrosion, Electronics – Waveguides, sensors, heat sinks and more
Fortify is continually expanding our network of CM, Material and Technology partners. If you’re interested in becoming a partner click the button below, complete the form, and we will be in touch very soon!