What's in YOUR resin?

HIGH PERFORMANCE, HIGH VISCOSITY MATERIALS

Digital Tooling

High HDT and high stiffness ceramic-fiber reinforced photopolymer tuned for use in tooling applications such as injection molding or thermoforming. Exhibiting an HDT greater than 300 degrees C, this material can withstand shots of aggressive plastics such as polycarbonate or ULTEM.

Key Material Properties:

  • Heat Deflection Temperature (@ 0.455 MPa): > 300 °C
  • Tensile Strength: 90 MPa
rf
rf
rf

Low Loss Dielectric Resin 2.8

Developed in collaboration with Rogers Corporation, this low-loss dielectric materials is used for printing components and devices used in wide bandwidth, high frequency communication and sensing systems. Specifically tailored for microwave and mmWave applications.

Dielectric constant of devices printed with these materials are tuned using additives as well as through the use of spatial latticing.

Key Material Properties:

  • Dielectric Constant: 2.8
  • Dissipation Factor (@ 24 GHz): 0.0046
rf
rf
rf

High Purity Alumina (99.8%)

Developed in collaboration with Tethon3D, High Purity Alumina is an alumina-filled photoresin that sinters to a final part purity of 99.8% alumina with only 12% shrinkage. This is a great selection for applications that require high reliability, dielectric strength, corrosion resistance, thermal conductivity, and hardness.

Key Material Properties:

  • Chemical Purity: 99.8%
  • Operating Temperature: 1750 °C
Ceramic parts 3D printed on FLUX CORE
Ceramic parts 3D printed on FLUX CORE
Ceramic parts 3D printed on FLUX CORE

Low Shrink Aluminum Silicate

Developed in collaboration with Tethon3D, this mid-grade ceramic is designed for general industry use. This ceramic exhibits a remarkably low 5% shrink upon sintering to deliver high tolerance for both large and small parts that feature high geometric complexity.

Key Material Properties:

  • Post-sintered Shrink Factor: 5%
  • Operating Temperature: 1450 °C
Ceramic parts 3D printed on FLUX CORE
Ceramic parts 3D printed on FLUX CORE
Ceramic parts 3D printed on FLUX CORE

ESD High Temperature Resin

Photoresin that prevents static charge build-up on parts in operating conditions up to 284 °C. Electrostatic Discharge (ESD) of small voltages is enough to destroy sensitive electrical components or ignite flammable vapor. Parts made from Fortify’s ESD-HT photoresin are “static dissipative”, allowing for controlled static discharge with precisely tuned resistivities of 106 Ω/sq.

Key Material Properties:

  • Surface Resistivity: 106 Ω/sq
  • Heat Deflection Temperature (@ 0.455 MPa): 284 °C
rapid-9
rapid-9
rapid-9

Thermally Conductive Dielectric Resin

Material designed for thermal management applications that require electrical insulation. TCDR has a thermal conductivity of up 2 W/mK while maintaining impressive dielectric strengths over 27 kV/mm.

Key Material Properties:

  • Thermal Conductivity: 2 W/mK
  • Electrical Resistivity: 1016 Ω·cm

Standard Materials

Fortify is currently qualifying a range of popular Open Source materials for use on Fortify 3D printers. If there is a particular resin you are interested in, please let us know.