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HTS: High Temperature & Strength Photopolymer

HTS delivers material properties similar to engineering plastics like PEEK, Vespel®, Radel® and Torlon® via additive manufacturing.  Unlike many other high-performance photopolymers, HTS is a one pot system leading to higher productivity and less waste.

Key Material Properties:

  • HDT: >300 C
  • Ultimate Tensile Strength: 90 MPa in Z
EUP and fixtures in HTS

Digital Tooling Photopolymer

High strength, HDT, and stiff ceramic-fiber reinforced photopolymer tuned for use in tooling applications such as injection molding or thermoforming. Exhibiting an HDT greater than 300 degrees °C, this material can withstand shots of aggressive plastics such as polycarbonate or ULTEM.

Key Material Properties:

  • Heat Deflection Temperature (@ 0.455 MPa): > 300 °C
  • Tensile Strength: 90 MPa
Photopolymer for tooling applications

Radix™ 3D Printable Dielectric Materials

Developed in collaboration with Rogers Corporation, this low-loss dielectric material is used for 3D printing components and devices used in wide bandwidth, high-frequency communication, and sensing systems. Specifically tailored for microwave and mmWave applications, this material can also be metalized through post-processing.

The dielectric constant of devices 3D printed with these materials is tuned using additives and through the use of spatial latticing.

Key Material Properties:

  • Dielectric Constant: 2.8
  • Dissipation Factor (@ 24 GHz): 0.0046

High Purity Alumina (99.8%) Photopolymer

Developed in collaboration with Tethon 3D, High Purity Alumina is an alumina-filled photopolymer that sinters to a final part purity of 97% alumina. This material is a great selection for applications that require high reliability, dielectric strength, corrosion resistance, biocompatibility, or thermal isolation hardness.

Key Material Properties:

  • Chemical Purity: 97%
  • Operating Temperature: 1750 °C
High Purity Alumina Photopolymer for Technical Ceramics applications

Low Shrink Aluminum Silicate

Developed in collaboration with Tethon 3D, this mid-grade ceramic is designed for general industry use. This ceramic exhibits a remarkably low 5% shrink upon sintering to deliver high tolerance for both large and small parts that feature high geometric complexity.

Key Material Properties:

  • Post-sintered Shrink Factor: 5%
  • Operating Temperature: 1450 °C
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D

ESD High Temperature Resin

A photopolymer that prevents static charge build-up on parts in operating conditions up to 284 °C. Electrostatic Discharge (ESD) of small voltages is enough to destroy sensitive electrical components or ignite flammable vapor. Parts made from Fortify’s ESD-HT photopolymer are “static dissipative”, allowing for controlled static discharge with precisely tuned resistivities of 106 Ω/sq.

Key Material Properties:

  • Surface Resistivity: 106 Ω/sq
  • Heat Deflection Temperature (@ 0.455 MPa): 284 °C
ESD High-Temperature Resin for 3D printing

Standard Materials

Fortify is currently qualifying a range of popular Open Source materials for use on Fortify 3D printers. If there is a particular resin you are interested in, please let us know.

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