What's in YOUR resin?

HIGH PERFORMANCE, HIGH VISCOSITY COMPOSITE MATERIALS

Explore the unique composite materials and high-temperature photopolymer resins used with Fortify’s 3D printers.
EUP and fixtures in HTS
EUP and fixtures in HTS
EUP and fixtures in HTS

HTS; High Temperature & Strength Photopolymer

HTS delivers material properties similar to engineering plastics like PEEK, Vespel®, Radel® and Torlon® via additive manufacturing.  Unlike many other high-performance photopolymers, HTS is a one pot system leading to higher productivity and less waste.

Key Material Properties:

  • HDT: >300 C
  • Ultimate Tensile Strength: 90 MPa in Z
EUP and fixtures in HTS
EUP and fixtures in HTS
EUP and fixtures in HTS

Digital Tooling Photopolymer

High strength, HDT, and stiff ceramic-fiber reinforced photopolymer tuned for use in tooling applications such as injection molding or thermoforming. Exhibiting an HDT greater than 300 degrees °C, this material can withstand shots of aggressive plastics such as polycarbonate or ULTEM.

Key Material Properties:

  • Heat Deflection Temperature (@ 0.455 MPa): > 300 °C
  • Tensile Strength: 90 MPa
Luneberg lens
Luneberg lens
Luneberg lens

Radix™ 3D Printable Dielectric Materials

Developed in collaboration with Rogers Corporation, this low-loss dielectric material is used for 3D printing components and devices used in wide bandwidth, high-frequency communication, and sensing systems. Specifically tailored for microwave and mmWave applications, this material can also be metalized through post-processing.

The dielectric constant of devices 3D printed with these materials is tuned using additives and through the use of spatial latticing.

Key Material Properties:

  • Dielectric Constant: 2.8
  • Dissipation Factor (@ 24 GHz): 0.0046
Luneberg lens
Luneberg lens
Luneberg lens

High Purity Alumina (99.8%) Photopolymer

Developed in collaboration with Tethon 3D, High Purity Alumina is an alumina-filled photopolymer that sinters to a final part purity of 99.8% alumina with only 12% shrinkage. This material is a great selection for applications that require high reliability, dielectric strength, corrosion resistance, biocompatibility, or thermal isolation hardness.

Key Material Properties:

  • Chemical Purity: 99.8%
  • Operating Temperature: 1750 °C
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D

Low Shrink Aluminum Silicate

Developed in collaboration with Tethon 3D, this mid-grade ceramic is designed for general industry use. This ceramic exhibits a remarkably low 5% shrink upon sintering to deliver high tolerance for both large and small parts that feature high geometric complexity.

Key Material Properties:

  • Post-sintered Shrink Factor: 5%
  • Operating Temperature: 1450 °C
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D
Ceramic 3D Resin (Aluminum Silicate) from Fortify and Tethon3D

ESD High Temperature Resin

A photopolymer that prevents static charge build-up on parts in operating conditions up to 284 °C. Electrostatic Discharge (ESD) of small voltages is enough to destroy sensitive electrical components or ignite flammable vapor. Parts made from Fortify’s ESD-HT photopolymer are “static dissipative”, allowing for controlled static discharge with precisely tuned resistivities of 106 Ω/sq.

Key Material Properties:

  • Surface Resistivity: 106 Ω/sq
  • Heat Deflection Temperature (@ 0.455 MPa): 284 °C
Thermally Conductive Dielectric Resin for 3D printing
Thermally Conductive Dielectric Resin for 3D printing
Thermally Conductive Dielectric Resin for 3D printing

Thermally Conductive Dielectric Resin

This material is designed for thermal management applications that require electrical insulation. With a thermal conductivity of up to 2W/mK, TCDR has 10x the conductivity of any other photopolymer while maintaining impressive dielectric strengths over 27 kV/mm.

 

Key Material Properties:

  • Thermal Conductivity: 2 W/m⋅K
  • Electrical Resistivity: 10^16 Ω·cm
Thermally Conductive Dielectric Resin for 3D printing
Thermally Conductive Dielectric Resin for 3D printing
Thermally Conductive Dielectric Resin for 3D printing

ESD-Elastomer Resin

 Fortify’s ESD-Elastomer is the lowest durometer resin available in the 3D printing industry with electrostatically dissipative properties. Electrostatic Discharge (ESD) of small voltages is enough to destroy sensitive electrical components or ignite flammable vapor. With a Shore Hardness of 70A and surface resistivity of 105 – 107 Ω/sq, the ESD-Elastomer provides superior protection with the most scalable and highest resolution 3D printing platform. (DLP). 

Key Material Properties:

  • Electrical Resistivity (Ω/sq): 105 – 107
  • Hardness Shore A : 70

Standard Materials

Fortify is currently qualifying a range of popular Open Source materials for use on Fortify 3D printers. If there is a particular resin you are interested in, please let us know.