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Online Panel: Additive Manufacturing and 3D Printing Technologies for RF/Microwave Applications
January 19 @ 11:00 am - 12:15 pm UTC-5
This panel of experts will discuss a new generation of products enabled by additive manufacturing or 3D printing that are able to achieve shapes and materials properties that are not available from traditional manufacturing techniques. From PCBs to connectors to antennas to waveguides, many new additive manufacturing processes are creating lighter, smaller and better performing products than traditional processes in shapes that we not previously possible to realize.
Moderator: Pat Hindle, Editorial Director, Microwave Journal®
Panelist: Phil Lambert, Senior Applications Engineer, Fortify
Panelist: Trevor Polidore, New Product Development Group Leader, Rogers Corporation
Panelist: Dave Young, Senior Vice President and Chief Technology Officer, CAES
Panelist: Valentin Storz, General Manager of EMEA, Nano Dimension
Panelist: John Kawola, CEO, Boston Micro Fabrication (BMF)