White Paper

Applications Guide to 3D Printed Low-Loss Dielectric Structures Addressing Microwave/mmWave Challenges

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Traditional fabrication approaches of Microwave/mmWave devices have material, geometry, tolerance, and/or repeatability challenges. New 3D printable resins with desirable Microwave/mmWave characteristics are enabling 3D DLP manufacturing of low-loss and low-dielectric constant material for prototyping and production. This white paper discusses applications of this 3D dielectric structure fabrication process.

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